The Ultimate Chiplet Interconnect. Period.
Eliyan’s PHY technology, NuLink™, enables the creation of super large SiPs on Standard Packaging, thus improving AI performance 10X by eliminating The Memory Wall
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AI Performance
"Eliyan’s chiplet interconnect technology will make multi-die approaches more attractive to chip suppliers whose designs must optimize on power and bandwidth vectors."
John Lorenz, Senior Analyst
at Yole Intelligence
"When I first heard from Ramin and team what they're working on ... achieving those numbers is magical. I can't wait for [Eliyan IP] to be put into some interesting projects my team is involved in."
Raja Koduri, CEO
at Mihira Al